随着 AI、高性能计算（HPC）、Chiplet 及先进封装技术快速发展，叠加英特尔等厂商推动玻璃基板封装落地，半导体产业正加速向更高集成、大尺寸、低成本方向迈进。作为先进封装的重要发展方向，板级封装（PLP）凭借更大的加工面积、更高的材料利用率和更优的规模化制造能力，正成为行业关注的热点。
然而，板级封装在提升生产效率和降低制造成本的同时，也对关键功能膜层的制备精度提出了更高要求。如何在大尺寸基板上实现高均匀性、高效率的功能膜层制备，成为 PLP 产业化面临的重要挑战。
针对上述痛点，曼恩斯特推出狭缝式平板涂布系统解决方案，形成覆盖核心部件、核心装备、整线集成、工艺开发及材料验证的全链条技术服务体系，支撑板级封装规模化量产。
01
均匀成膜
破解大尺寸基板一致性难题
在板级封装过程中，随着加工面积增加，涂布易出现流场不均、边缘堆积、膜厚波动等问题。
曼恩斯特狭缝式平板涂布系统依托自研高精度模头、精密供液系统与运动控制平台，有效涂布区域内膜厚均匀性≤3%，有效区域占比＞95%，从工艺源头降低膜厚波动与针孔等缺陷概率，保障介电层均匀性与阻隔性，为重布线层（RDL）精细制作筑牢工艺基础，提升封装良率与可靠性。
02
精准控制
满足多材料复杂工艺需求
板级封装涵盖多种功能材料，黏度、流变特性与工艺窗口差异大，供液精度不足或参数控制不稳定，易导致膜层厚度波动、材料浪费甚至工艺失效，影响产品一致性。
曼恩斯特自研高精度注液泵，控制分辨率达到0.01 μL/s，响应时间仅0.01 s，可实现亚微米级膜厚的精准调控；搭配自研整线控制软件与闭环算法，实时调节流量、速度、间隙等关键参数，适配多层制程的差异化需求。
03
量产导入
构建规模化制造能力
围绕量产需求，曼恩斯特打造了覆盖工艺开发到规模生产的一体化平板涂布平台。
设备采用模块化设计，模头加工最大长度4000mm，可完成大尺寸基板一次性均匀成膜，支持300×300 mm至800×800 mm等多种板级尺寸与定制规格。
曼恩斯特狭缝平板涂布机
此外，设备配备减震结构与翘曲控制工艺，保障成膜均一性的同时，降低芯片偏移、崩边、碎裂风险，为板级封装量产提供可靠保障。
04
一套技术平台
覆盖多元应用场景
曼恩斯特平板涂布系统不仅服务于先进板级封装，其核心能力同样适用于其他需要大面积、高均匀性功能薄膜制备的先进制造领域。
在钙钛矿太阳能领域，曼恩斯特 GW 级平板涂布平台已应用于大尺寸组件制造，积累了丰富的大面积连续涂布经验。在先进显示领域，围绕 Mini LED、Micro LED 及其他新型显示技术，对高均匀性功能膜层制备的需求持续增长，精密平板涂布同样展现出广阔的应用潜力。
从先进板级封装，到钙钛矿太阳能，再到新型显示面板，不同产业虽然采用不同材料体系和工艺路线，但都对大面积、高均匀性、连续化制造提出了共同要求。
未来，曼恩斯特将持续深耕精密平板涂布技术，依托自主核心部件、智能装备与工程化能力，为全球先进制造提供工艺开发、装备集成到量产落地的整体解决方案，持续推动大面积功能薄膜制造向更高精度、更高效率和更高可靠性发展。
Fueled by rapid advances in AI, High-Performance Computing (HPC), Chiplet and advanced packaging technologies, coupled with the commercialization of glass substrate packaging spearheaded by Intel and other manufacturers, the semiconductor industry is rapidly moving toward higher integration, larger panel formats and lower manufacturing costs. As a key pathway for advanced packaging, Panel-Level Packaging (PLP) has emerged as a major industry focus, benefiting from its larger processing area, improved material utilization and superior scalability for mass production.
Nevertheless, while boosting production efficiency and cutting manufacturing costs, PLP imposes stricter requirements on the deposition precision of critical functional films. Achieving high-uniformity, high-efficiency functional film coating on large-format substrates has become a major bottleneck hindering the industrialization of PLP.
To address these challenges, MANST has launched a slot-die flatbed coating system solution, building a full-spectrum technical service system covering core components, complete equipment, whole-line integration, process development and material validation, to support mass production of panel-level packaging.
Uniform Coating: Resolve Consistency Issues on Large-Size Substrates
As processing dimensions expand in panel-level packaging, coating defects such as uneven flow distribution, edge buildup and film thickness variation frequently occur. Leveraging self-developed high-precision coating dies, precision liquid supply systems and motion control platforms, MANST’s slot-die flatbed coating system delivers film thickness uniformity ≤3% within the effective coating area, with an effective coverage ratio above 95%. It minimizes defects including thickness deviation and pinholes at the source, ensures excellent uniformity and barrier performance of dielectric layers, lays a solid process foundation for fine patterning of Redistribution Layers (RDL), and improves packaging yield and long-term reliability.
Precision Regulation: Adapt to Complex Processes with Multiple Materials
Panel-level packaging involves various functional materials with vastly different viscosity, rheological properties and process windows. Insufficient liquid feeding precision or unstable parameter control tends to trigger film thickness fluctuation, material waste and even process failure, undermining product consistency.
MANST’s self-developed high-precision dispensing pump features a control resolution of 0.01 μL/s and a response time of only 0.01 s, enabling precise regulation of submicron-level film thickness. Paired with proprietary whole-line control software and closed-loop algorithms, it dynamically adjusts key parameters including flow rate, coating speed and die gap to accommodate differentiated requirements of multi-layer processes.
Mass Production Deployment: Establish Scalable Manufacturing Capacity
Tailored for volume production demands, MANST has built an integrated flatbed coating platform spanning process development to large-scale manufacturing. Adopting a modular design, the coating die supports a maximum coating width of 4000 mm, enabling one-step uniform coating on large substrates. It is compatible with standard panel sizes ranging from 300×300 mm to 800×800 mm, as well as customized specifications. Furthermore, equipped with shock-absorbing structures and proprietary warpage control processes, the system preserves coating uniformity while mitigating risks of chip offset, edge chipping and cracking, delivering robust assurance for PLP mass production.
One Technology Platform, Covering Diverse Application Scenarios
Beyond advanced panel-level packaging, MANST’s flatbed coating technology can be deployed across other advanced manufacturing sectors requiring large-area, highly uniform functional thin films.
In perovskite solar energy, MANST’s GW-scale flatbed coating platforms have been deployed for large-format module production, accumulating rich experience in continuous large-area coating. In advanced display, demand for highly uniform functional film deposition keeps rising for Mini LED, Micro LED and other emerging display technologies, where precision flatbed coating demonstrates broad application prospects.
Though adopting distinct material systems and process routes, advanced panel packaging, perovskite photovoltaics and advanced display manufacturing share identical demands for large-area, high-uniformity and continuous film production.
Going forward, MANST will continue to deepen its expertise in precision flated coating technology. Relying on in-house core components, intelligent equipment and engineering capabilities, the company will provide end-to-end solutions encompassing process development, equipment integration and mass production rollout for global advanced manufacturing, and propel large-area functional thin-film manufacturing toward higher precision, greater efficiency and enhanced reliability.